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Home>New In>35g BGA Syringe Solder Paste Contains Lead Sn63/Pb37 Melting Point 183℃
35g BGA Syringe Solder Paste Contains Lead Sn63/Pb37 Melting Point 183℃

35g BGA Syringe Solder Paste Contains Lead Sn63/Pb37 Melting Point 183℃

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  • Detail
    • Product Name: 35g BGA Syringe Solder Paste Contains Lead Sn63/Pb37 Melting Point 183℃
    • Item NO.: 6760867332272
    • Weight: 0.03 kg = 0.0661 lb = 1.0582 oz
    • Category: New In
    • Brand: verygmall
    • Creation Time: 2021-07-08

    Every person that solders should have some it this in there kit

    SMART DESIGN
    New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.Adapted to the mobile phone repair industry, computer digital service industries and high-presicion circuit board soldering SMT/BGA soldering processes.

    PCB/BGA DEDICATED
    High-end quality, a unique formula, perfect performance, easy to weld, solder joint is bright and full, no weld, false welding phenomenon.


    WIDELY APPLICABLE
    The residue is colorless and transparent, does not affect t he detection, disposable and excellent cleaning performance. Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern.


    REVOLUTIONARY DURABILITY
    Wetting, anti-dry, relatively long shelf life at room temperature. Unique high-quality solder paste, fine and flexible packaging (10 cc/support), delicate appearance.

    What is the solder tin paste?

    • Solder tin paste is a new type of solder material that comes with SMT.
    • Solder paste is a complex system that is made of a paste of solder powder, flux, and other additives.
    • At the normal temperature, the solder tin paste has a certain viscosity, and the electronic component can be initially adhered to a predetermined position.
    • At the soldering temperature, the soldered component and the printed circuit pad are soldered together(Permanent connection.) with the evaporation of the solvent and some additives.

    Preservation method:

    • The solder paste should be kept at 1-10℃.
    • Before the opening, the temperature of the solder paste should be raised to the ambient temperature (25℃), and the temperature return time should be about 3-4 hours.
    • The solder paste should be used for 6 months.
    • The solder paste should not be placed in the sun.

    Precautions:

    • Use only with adequate Ventilation.
    • The solder paste contains organic solvent. Avoid repeated contact with skin. If the solder paste gets on your skin, wipe it off with alcohol and rinse thoroughly with water.
    • Avoid contacting with eyes.
    • Keep away from children.


    Shipping:

    • Receiving time = Processing time+Shipping time
    • Order processing time varies from 1-3 days
    • Delivery time varies from 7-15 Business days
    • Shipping With Tracking Number
    • Return Policy:
    • Our Guarantee
    • Return or exchange within 15 days from the delivered date.
    • Request:
    • Items received within 15 days from the delivered date.

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35g BGA Syringe Solder Paste Contains Lead Sn63/Pb37 Melting Point 183℃
color:red,size:xxl
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